The Lead PCB Design Engineer is responsible for leading the design, development, and optimization of printed circuit board (PCB) solutions for electronic products. This role ensures high-quality, manufacturable, and reliable PCB designs, drives design standardization and process improvements, provides technical leadership, and collaborates with cross-functional teams to deliver innovative and cost-effective products

"• Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release. 
• Able to lead Program with multiple PCBs and deliver with help of one or more resources 
• Design complex multi-layer PCBs for:
-Data center power distribution and management systems 
-Thermal management and cooling control systems 
-Know-how of OCP Rack and its structure 
-Hands-on experience in High Voltage, High Current PCBs 
Develop PCB solutions considering:
-Signal Integrity (SI) 
-Power Integrity (PI) 
-EMC/EMI compliance 
-Thermal performance 
-Reliability and Manufacturability 
• Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks. 
• Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance. 
• Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities. 
• Drive PCB design standardization, library management, design automation, and continuous improvement initiatives. 
• Mentor PCB designers and provide technical leadership across global engineering teams."

Required: Bachelor’s Degree in Electronics / Electronics and Communication / Electrical Engineering.

"• 12–14 years of PCB design experience in power electronics or thermal management products.

• Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.

"Required: 
Strong experience in below:
• Experience with High Power, Flex, Rigid Flex & HDI PCBS. 
• High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes) 
• Power electronics and power conversion systems 
• Creepage clearance and safety requirements 
• SI/PI analysis and simulation 
• Thermal-aware PCB design 
• DFM, DFA, and DFT methodologies 

Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions. 
Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers. 
Able to do Power Integrity or Signal Integrity Simulations will be added advantage 
Standards & Compliance: Strong working knowledge on below:
• IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc. 
• Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH 
 
Desired: 
• Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred. .
Special:
• CAM validation, check and basic editing of Gerber data using CAM350."
"• Strong leadership, communication, and problem-solving skills. 
• Ability to work effectively in cross-functional and global engineering environments. "